Flip chip in leaded molded package with two dies

   
   

A chip device including two stacked dies. The chip device includes a leadframe that includes a plurality of leads. A first die is coupled to a first side of the leadframe with solder and a second die is coupled to a second side of the leadframe with solder. A molded body surrounds at least a portion of the leadframe and the dies.

Um dispositivo da microplaqueta including dois dados empilhados. O dispositivo da microplaqueta inclui um leadframe que inclua um plurality das ligações. Um primeiro dado é acoplado a um primeiro lado do leadframe com solda e um segundo dado é acoplado a um segundo lado do leadframe com solda. Um corpo moldado cerca ao menos uma parcela do leadframe e dos dados.

 
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> Semiconductor device having semiconductor element with copper pad mounted on wiring substrate and method for fabricating the same

> Semiconductor device, mounting and method of manufacturing mounting substrate, circuit board, and electronic instrument

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