Slurry for CMP, and method of manufacturing semiconductor device

   
   

There is disclosed a CMP slurry which comprises a solvent, abrasive grains, and a silicone-based surfactant having an HLB value ranging from 7 to 20.

È rilevato i residui del CMP che contengono un solvente, i grani abrasivi e un agente tensioattivo silicone-basato che ha un valore di HLB variare da 7 a 20.

 
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