A manufacturing method of semiconductor devices, micromachines such as
semiconductor device, narrow pitch connectors, electrostatic actuators or
piezoelectric actuators, and ink jet heads, ink jet printers, liquid
crystal panels, and electronic appliances, including them characterized in
that short circuit due to dusts floating in the air will not take place.
In a method where a silicon wafer (30) undergoes dicing to manufacture
semiconductor devices (20), a groove (30a) covered by an insulating layer
and spanning a dicing line is formed in the above described silicon wafer,
and the silicon wafer undergoes dicing along the dicing line.
