An electronic package assembly where a low profile integrated circuit chip
package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a
printed circuit board or card, the projecting conductive leads of the
integrated circuit chip package and the solder which substantially covers
these leads (and respective conductors on the substrate) having been
substantially covered with ultraviolet photocured encapsulant material
(e.g., polymer resin) to provide reinforcement for the solder-lead
connections. The encapsulant material is dispensed about the solder and
lead joints following solder reflow and solidification so as to
substantially surround the solder and any portions of the leads not
covered with solder.
