A semiconductor device in accordance with one example of the present
invention pertains to a semiconductor device to be used for a CMOS
inverter circuit, comprising a BOX layer 2 formed on a silicon substrate
1, a SOI film 3 including single crystal Si formed on the BOX layer, a
gate oxide film 4 formed on the SOI film 3, a gate electrode 5 formed on
the gate oxide film, and diffusion layers 7, 8 for source/drain regions
formed in source/drain regions of the SOI film 3, wherein, when a power
supply voltage of 0.6 V is used, a thickness T.sub.SOI of the SOI film 3
is 0.084 .mu.m or greater and 0.094 .mu.m or smaller, and an impurity
concentration of the SOI film is 7.95.times.10.sup.17 /cm.sup.3 or greater
and 8.05.times.10.sup.17 /cm.sup.3 or smaller.