Microelectromechanical system package with environmental and interference shield

   
   

A microelectromechanical system package has a microelectromechanical system microphone, a substrate, and a cover. The substrate has a surface for supporting the microelectromechanical microphone. The cover includes a conductive layer having a center portion bounded by a peripheral edge portion. A housing is formed by connecting the peripheral edge portion of the cover to the substrate. The center portion of the cover is spaced from the surface of the substrate to accommodate the microelectromechanical system microphone. The housing includes an acoustic port for allowing an acoustic signal to reach the microelectromechanical system microphone.

Un système matériel/logiciel microelectromechanical a un microphone microelectromechanical de système, un substrat, et une couverture. Le substrat a une surface pour soutenir le microphone microelectromechanical. La couverture inclut une couche conductrice faisant lier une partie centrale par une partie périphérique de bord. Un logement est constitué en reliant la partie périphérique de bord de la couverture au substrat. La partie centrale de la couverture est éloignée de la surface du substrat pour adapter au microphone microelectromechanical de système. Le logement inclut un port acoustique pour permettre un signal acoustique pour atteindre le microphone microelectromechanical de système.

 
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