Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing page

Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing

An evaluating pattern is comprised of a conductive pattern which has a rectangular configuration, an insulating layer which is formed on the conductive pattern, and a conductive material filled into contact holes which is formed in the insulating layer on the middle of the conductive pattern.

Web www.patentalert.com

< System and method for preventing a spoofed remote procedure call denial of service attack in a networked computing environment

< Hierarchical trusted code for content protection in computers

> Method of testing a semiconductor package device

> Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration

~ 00123