A semiconductor package according to the present invention includes a die
attachment area for receiving a die attachment material and a stitch bond
area for receiving a wire lead from a die. The stitch bond area is
adjacent to said die attachment area on the substrate. Moreover, a stud
bump is formed on the substrate for preventing the die attachment material
from contacting the stitch bond area when a die is attached to the die
attachment area. A method for manufacturing a semiconductor package
according to the present invention also is disclosed.
