The present invention provides a method of manufacturing a metal foil
laminated plate comprising the step of forming and attaching a resin
porous layer onto a metal foil by a wet coagulating method, wherein a
metal foil including a conductive bump having an almost equal height on a
film forming side surface is used. The present invention provides a metal
foil laminated plate comprising a metal foil including a conductive bump
having an almost equal height and a resin porous layer laminated
integrally, the conductive bump being exposed. The present invention
provides another metal foil laminated plate comprising a metal foil
including a conductive bump having an almost equal height, a resin porous
layer laminated integrally, and a thermosetting resin impregnated in a
hole of the resin porous layer, in which the conductive bump is exposed
from the resin porous layer.
