An electronic component includes via holes having an elongated cross
section, which are provided in a ceramic green molded product provided
with a plurality of terminal conductors to define external terminal
electrodes. Thereby, a portion of each terminal conductor is exposed on
the inner wall of a piecing hole. The ceramic molded product is fired to
obtain a ceramic sintered product. Then, the sintered product is split
along cutting grooves passing through the via-holes, wherein ceramic
electronic components are produced.
