Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
   
   

Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.

 
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> Composition based on cross-linked starch and depolymerized starch suitable as gelatine replacement

> Method of making sized paper, a sized paper grade, and a paper size
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