A curable coating composition is disclosed comprising a resinous binder
comprising (a) a reaction product of an epoxy-containing polymer with a
compound containing phosphorus acid groups, the reaction product having
reactive functional groups, and (b) a curing agent having functional
groups reactive with the functional groups of (a). An electroconductive
pigment is dispersed in (a) such that the weight ratio of the
electroconductive pigment to (a) plus (b) is within the range of 0.5 to
9.0:1. When the curable coating composition is deposited and cured on a
metal substrate, the cured coating is weldable.
