A processing apparatus for processing a microelectronic workpiece includes
a metrology unit and a control, signal-connected to the metrology unit.
The control can modify a process recipe or a process sequence of the
processing apparatus based on a feed forward or a feed back signal from
the metrology unit. A seed layer deposition tool, a process layer
electrochemical deposition tool, and a chemical mechanical polishing tool,
arranged for sequential processing of a workpiece, can be controlled as an
integrated system using one or more metrology units. A metrology unit can
be located at each tool to measure workpiece parameters. Each of the
metrology units can be used as a feed forward control and/or a feed back
control at each of the tools.
