A microelectromechanical structure and method is disclosed. A ceramic
substrate preferably is formed from low temperature co-fired ceramic
sheets. A low loss photodefinable dielectric planarizing layer is formed
over one surface of the ceramic substrate. This layer can be a sacrificial
layer or a subsequent sacrificial layer added. A photodefined conductor is
printed over the low loss dielectric planarizing layer and formed with the
sacrificial layer into a structural circuit component. In one aspect of
the invention, a switch is formed with a biasing actuator and deflectable
member formed over the biasing actuator and moveable into open and closed
circuit positions.
