Surface applied passive devices for use on electronic circuit boards are
formed by applying layers of conductive, insulating, and other material to
a thin polymer film carrier. The surface applied passives are thin enough
to fit underneath standard integrated circuit packages in order to
conserve space on the circuit board. Resistors, capacitors, inductors and
other passive circuits may be formed on thin polymer films, less than 8
mils thick. This significantly aids in conserving space on an electronic
circuit board.
