An apparatus including a contact point on a substrate; a first dielectric
layer comprising a material having a dielectric constant less than five
formed on the contact point, and a different second dielectric layer
formed on the substrate and separated from the contact point by the first
dielectric layer. Collectively, the first and second dielectric layers
comprise a composite dielectric layer having a composite dielectric
constant value. The contribution of the first dielectric layer to the
composite dielectric value is up to 20 percent. Also, a method including
depositing a composite dielectric layer over a contact point on a
substrate, the composite dielectric layer comprising a first material
having a dielectric constant less than 5 and a second different second
material, and forming a conductive interconnection through the composite
dielectric layer to the contact point.
