A speaker spider arrangement includes a speaker spider and an integral lead
wire arrangement which includes at least a pair of lead wires and an
attachment member for attaching attachment portions of the lead wires on
one side surface of the speaker spider so as to ensure the attachment
portions of the lead wires being spacedly extended between an inner rim
and an outer rim of the speaker spider and to integrate with the speaker
spider to move simultaneously. Thereby, the integral lead wire arrangement
provides the speaker spider with an enhanced durability, higher sound
quality and improved safety, so as to enable a speaker to be manufactured
by less steps in a lower cost while achieving a higher quality in
comparison with the conventional speaker structure.
