A Pb-free soldering alloy that does not include any Pb is provided. The
soldering alloy prevents Cu present in a printed-circuit board from
combining with Ni in the soldering alloy at the soldered part, prevents Cu
from precipitating and diffusing in the soldering alloy, suppresses the
generation of fine cracks at the soldered part and increases the
mechanical strength of the soldered part. The Pb-free soldering alloy
contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the
balance.
_ uno Pb-libre soldering aleación que no incluir cualquier Pb ser proporcionar. _ soldering aleación prevenir Cu presente en uno circuito tablero combining con ni en soldering aleación en soldar parte, prevenir Cu precipitating y diffusing en soldering aleación, suprimir generación fino grieta en soldar parte y aumentar mecánico fuerza soldar parte. _ Pb-libre soldering aleación contener 3.5 6.0 peso % AG, 0.001 1.0 peso % ni y sn para balance. _
