Method for manufacturing a wiring harness or a substrate for wiring wherein
the wiring diagram applied to the substrate is based on the wiring harness
information. Entities representing connectors, binding parts, and wiring
length information of wirings are input. The wiring arrangement diagram
includes lines that correspond to the wirings and do not have a length
corresponding to actual length of the wirings. The wiring harness is made
using the information including total length of wiring between each of the
connectors, harness information generated based on the entities, and the
length information of the desired wiring arrangement. Alternatively, the
wiring harness information is used to draw a wiring diagram for fixing on
the substrate.
