The non-contact data carrier has a resin substrate, a metallic antenna coil
on the resin substrate, and an IC chip connected to the antenna coil via a
plurality of bumps. Each bump of the IC chip has a base on the side of the
IC chip body of the data carrier and a projection held by the base via a
shoulder. Each bump is connected to the antenna coil by piercing the
projection into the antenna coil.
