Apparatus for defining patterns electrochemically on conductive materials by forming the patterns as conductive features of a tool, providing insulative properties about the conductive features so the patterns are defined; then providing an immersive medium including an etchant or plating material for defining the pattern on a workpiece, providing an electric direct current so that the immersive medium is concentrated at desired locations defined by the conductive features on the conductive materials; and etching the conductive materials by applying the electric current in a quantity and for an elapsed time to etch or plate patterns in or on the conductive materials.