A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic resin having a load deflection temperature (ASTM D-648) under a load of 1.82 MPa of not lower than 60.degree. C., and (B) a heat seal layer comprising at least one resin selected from polyvinyl chloride resin, polyester resin, polyurethane resin, acrylic resin containing a functional group and ethylene copolymer which have a Tg of 30-60.degree. C., and an electroconductive fine powder dispersed in said resin.