The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.

L'invention fournit les adhésifs et les compositions adhésives qui comportent la résine époxyde et l'anhydride non-volatile. Une incorporation autre comporte un hydroxyle contenant le composé qui est insoluble dans le mélange époxyde de resin/anhydride aux températures de mélange qui réagit avec de l'anhydride aux températures de ré-écoulement de soudure à la forme un agent jaillissant in-situ. Une autre incorporation autre comporte le catalyseur.

 
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< Epoxy based reinforcing patches with improved adhesion to oily metal surfaces

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> Method for the production of glass or plastic laminates by use of a curable blend of an epoxy resin and a high Tg polymer

> High-pressure device

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