Methods and systems for evaluating stresses in line features formed on substrates. Stresses may be computed from measured curvature information based on simple analytical functions. The curvature information can be obtained optically by, e.g., a coherent gradient sensing method, to obtain a full-field measurement of an illuminated area.

 
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< Apparatus and method for measuring pattern alignment error

> Semiconductor laser with multiple lasing wavelengths

> Solid-state laser cooling

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