A method for making a bump and trace layout for an integrated circuit die includes the step of replicating a routing tile having a first column of I/O pads and a second column of I/O pads wherein the first column is offset from the second column so that the I/O pads of the first column are interleaved between the I/O pads of the second column.

Un metodo per fare una disposizione della traccia e dell'urto per un dado del circuito integrato include il punto di replica delle mattonelle di percorso che hanno una prima colonna dei rilievi di I/O e una seconda colonna dei rilievi di I/O in cui la prima colonna รจ sfalsata dalla seconda colonna in moda da interfogliare i rilievi di I/O della prima colonna fra i rilievi di I/O della seconda colonna.

 
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