Disclosed is a matrix type printed circuit board (PCB) for semiconductor packages having a structure including a plurality of PCB units arranged in a matrix array having at least two rows in such a fashion that the mold runner gates of adjacent PCB units respectively arranged in adjacent rows while being arranged in the same column communicate with each other by an integrate mold runner, thereby being capable of allowing an increased number of PCB units to be simultaneously processed in each process involved in the fabrication of semiconductor packages, so that a great improvement in productivity is achieved. In particular, it is possible to allow an increased number of PCB units to be simultaneously molded in a resin encapsulate molding process, thereby achieving a great improvement in the efficiency of the resin encapsulate molding process. Furthermore, surplus encapsulating resin materials cured in the mold runner gates and integrate mold runners can be easily and reliably removed in accordance with a degating and/or deculling process without a surface damage of the PCB. It is also possible to achieve an easy open/short circuit test for individual PCBs.