The present invention provides a non-cyanide electrolytic gold plating solution comprising a gold compound, as a source material for gold, selected from the group consisting of a gold salt and a gold complex, a buffering agent, an organic brightener, and a conductive salt, wherein 1,2-ethanediamine is contained in the gold plating solution. The gold plating solution has excellent liquid stability in a bath and causes no change in the physical properties of the deposited gold or no decomposition of the solution during the operation of gold plating. The gold plating solutions include both a type in which a bis(1,2-ethanediamine) gold complex is used as a source material for gold, and a type in which a gold salt is used as a source material for gold. The gold plating solution is an unprecedentedly good electrolytic gold plating solution in which the hardness, purity, state of the deposited crystals and so on can be controlled.