An improved atomic layer doping apparatus is disclosed as having multiple doping regions in which individual monolayer species are first deposited and then dopant atoms contained therein are diffused into the substrate. Each doping region is chemically separated from adjacent doping regions. A loading assembly is programmed to follow pre-defined transfer sequences for moving semiconductor substrates into and out of the respective adjacent doping regions. According to the number of doping regions provided, a plurality of substrates could be simultaneously processed and run through the cycle of doping regions until a desired doping profile is obtained.

 
Web www.patentalert.com

< Method of forming a bond pad and structure thereof

< Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques

> Devices containing zirconium-platinum-containing materials and methods for preparing such materials and devices

> MOSFETs with differing gate dielectrics and method of formation

~ 00066