Development electrode wires for use in a Scavengless or Hybrid Scavengless Development system are treated using Ion Implantation so as to minimize the creation of charge potential between the electrode wires and developer material during frictional contact therebetween. Treatment of the wires using Ion Implantation for minimizing the creation of a charge potential is effected without diminishing the hardness of the wire material. In fact, wire hardness and resistance to wire contamination are enhanced using Ion Implantation in fabricating the wires. A bare wire used for the electrode is first plated with a Gold/Platinum alloy. The ions become implanted in the substrate without altering the surface finish of the wire electrodes yet alter the tribo-charging properties or Electronegativity of the wire. The result of Ion Implantation is to tune or match the Electronegativity of the electrode wire with the Electronegativity of the toner material used in the development system.