A compliant hearing aid has a housing formed with an exterior peripheral layer of a deformable material. Electronic components located within the deformable layer can be encapsulated, at least in part, with a second deformable material. The second material also fills voids in the interior of the deformable peripheral layer. The second material can be cured within the deformable layer. Alternately, the second material can be cured apart from the deformable layer. The layer can then be attached to the second material.