A method for use in the manufacture of a microelectronic device is set forth. The method include to a first step in which a workpiece including exposed metallized surfaces and residues is provided. The workpiece, including the exposed metallized surfaces, is then treated with an alkaline, water-based solution containing one or more components that form an additive layer of an anti-corrosive compound on the exposed metallized surfaces. The solution reacts with the residues and assists in removing them from the workpiece. When the surfaces are principally include of aluminum, the solution may be include of DI water, an ammonium hydroxide based component, such as TMAH, silicic acid, and aluminum hydroxide.

Um método para o uso na manufatura de um dispositivo microelectronic é determinado. O método inclui a uma primeira etapa em que um workpiece including superfícies e resíduos metalizados expostos é fornecido. O workpiece, including as superfícies metalizadas expostas, é tratado então com uma solução alcalina, water-based que contem um ou mais componente que dão forma a uma camada aditiva de um composto anti-corrosive nas superfícies metalizadas expostas. A solução reage com os resíduos e ajuda em removê-los do workpiece. Quando as superfícies são principalmente inclua do alumínio, a solução pode ser incluem de DI água, um componente baseado do hydroxide de ammonium, tal como TMAH, ácido silicic, e hydroxide de alumínio.

 
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