This invention relates to underfill encapsulant compositions prepared from allylated amide compounds to protect and reinforce the interconnections between an electronic component and a substrate in a microelectronic device.

Esta invenção relaciona-se ao underfill que as composições encapsulant preparadas do allylated compostos do amido para proteger e reforçar as interconexões entre um componente eletrônico e uma carcaça em um dispositivo microelectronic.

 
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