A pad including thermal insulation and heat sink areas. The pad includes a plurality of layers of metal foil forming a stack with the layers arranged one above the other, the stack including at least one heat sink area and at least one insulating area adjacent to the heat sink area, the layers providing better heat conduction in the vertical direction at the heat sink area than at the insulating area. At least one of the layers includes a plurality of embossments therein separating the one layer from an adjacent one of the layers in the insulating area. The pad can include a single insulating area surrounded by a heat sink area and a black coating can be provided on selected portions of the layers to improve heat radiating characteristics of the pad. For instance, the heat sink area can be coated with the black coating to radiate heat away from the pad at a desired location. The pad is particularly useful in shielding a heat sensitive component on one side of the pad from a heat source on the other side of the pad. The pad can be covered with a prescored and/or embossed metal sheet coated on one or both sides with adhesive. The sheet can also be used by itself for fixturing. The sheet can be secured to an object by heating to cause the adhesive to adhere to the object. The prescoring can be perforations in the sheet and the embossments can be in a diamond shaped cross-hatching configuration.