A plastic film capacitor shield wherein the shield is secured to an outer surface of plastic film capacitor. The shield is sufficient to protect the plastic film capacitor from excessive radiant infrared energy during infrared reflow soldering which could damage the plastic film capacitor. The plastic film capacitor shield can be composed of many different materials such as electrical grade tape, electrical grade plastic, metal tape, or epoxy. The shield can be attached to the capacitor in various ways, which includes: securing a shield to an upper surface of the capacitor; having a shield on an upper and lower surface of the capacitor, wrapping and securing a shield to the plastic film capacitor on four sides of the capacitor; securing a shield on all sides of the capacitor; and securing a combination of different shields to the outer surfaces of the capacitor.