A spherical body grinding and polishing apparatus comprises: a rotary shaft having a spiral path groove in the outer cylindrical surface along which spherical bodies to be processed are moved, the rotary shaft being vertically movable and rotatable; and a housing having grinding and polishing surfaces on which the spherical surfaces of the spherical bodies moving along the path groove are slid. When spherical bodies such as silicon spherical bodies are supplied to the apparatus, the spherical bodies are rolled and moved along the spiral path groove formed in the outer cylindrical surface of the rotary shaft while sliding on the inner surface of the housing, so that the outer surfaces of the spherical bodies are ground and polished until the spherical bodies become high in sphericity.